INORGANIC POWDER FOR HEAT-DISSIPATING RESIN COMPOSITION, HEAT-DISSIPATING RESIN COMPOSITION USING SAME, AND METHODS FOR PRODUCING SAME

摘要

Provided are an inorganic powder suitable for producing a thick heat-dissipating resin composition and a heat-dissipating resin composition using the same. An inorganic powder 10 for use in a heat-dissipating resin composition 20 includes first inorganic particles 11 having a particle size of less than 53 μm and second inorganic particles 12 having a diameter of 100 μm or more and a BET specific surface area of 2 m²/g or less, the amount of the second inorganic particles 12 being 30%-95% by mass. The heat-dissipating resin composition 20 includes a resin 30 and the inorganic powder 10, and the amount of the second inorganic particles 12 in the heat-dissipating resin composition 20 is 100 parts by weight or more per 100 parts by weight of the resin.