INTERPOSER BASED IMAGING SENSOR FOR HIGH-SPEED IMAGE ACQUISITION AND INSPECTION SYSTEMS

摘要

The invention relates to an interposer disposed on a surface of a substrate, a photosensitive array sensor disposed on an interposer, wherein the photosensitive array sensor is thinned back and is configured for back illumination, wherein the photosensitive array sensor comprises pixel rows. At least one amplifying circuit element configured to amplify the output of the photosensitive array sensor, the amplifying circuit being operatively connected to the interposer, at least one analog-to-digital conversion circuit element configured to convert the output of the photosensitive array sensor into a digital signal. The ADC circuit element is operably connected to the interposer, at least one driver circuit element configured to drive a clock or control signal of the photosensitive array sensor, the interposer comprising a photosensitive array sensor, an amplifying circuit, a conversion circuit, Electrically at least two of the driver circuit, or one or more additional circuits. Configured to connect.