Mold apparatus Experiment apparatus for mold die measure and the measuring method

摘要

The present invention relates to a mold die parallelization degree measurement method, which comprises the following steps of: arranging a sensor in a lower mold facing an upper mold; repeatedly lifting the upper mold; detecting the lifted upper mold with the sensor and detecting a period value detected in the sensor; and calculating a right angle degree of an upper surface of the lower mold and a lower surface of the upper mold in a first direction to measure a parallelization degree of the lower mold and the upper mold in the first direction.