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- Multi-layered resistive-thermocouple type temperature measuring wafer sensor and method for fabricating the same
- Multi-layered resistive-thermocouple type temperature measuring wafer sensor and method for fabricating the same
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机译:-多层电阻式热电偶式测温晶片传感器及其制造方法
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摘要
According to the present invention, a wafer sensor comprises: a plurality of reference resistors for measuring a reference temperature as a resistive temperature sensor; and one or more thermoelectric units connected in series to one end of the reference resistors as a thermoelectric temperature sensor. The thermoelectric units and a connection wiring are arranged on different layers. In particular, the thermoelectric units are formed by alternately repeating two types of lines forming a thermocouple by 100-1,000 times. Each of the thermoelectric units are formed on a layer different from a layer in which the connection wiring is formed, thereby being uniformly installed in the entire area of the wafer sensor without interrupting the wiring. In particular, the reliability of a measured temperature can be improved by correcting a reference temperature and a Seebeck coefficient of the thermoelectric units using the reference resistors, and an electromotive force measured by each of the thermoelectric units are physically amplified, thereby more conveniently performing measurement. Therefore, temperature uniformity with respect to the entire area of a wafer can be more conveniently and accurately recognized.
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