首页> 外国专利> Polyamide resin composition, and polyamide resin composition and rotational molded article for rotational molding using the same

Polyamide resin composition, and polyamide resin composition and rotational molded article for rotational molding using the same

机译:聚酰胺树脂组合物,聚酰胺树脂组合物及使用其的滚塑成型品

摘要

The present invention provides a polyamide resin composition excellent in low-temperature impact resistance and surface properties, and a polyamide resin composition for rotational molding using the same and a rotational molded article. In the polyamide resin composition according to the present invention, according to JIS K6920, 96 parts by weight of sulfuric acid, 1% by weight of polymer concentration, and an aliphatic polyamide having a relative viscosity ηr of less than 2.60 measured under conditions of 25 ° C, a part by weight, ASTM D1505 The modified polyolefin having a density of 0.895 g / cm 3 or less measured according to b parts by weight, and an unmodified polyolefin having an MFR value of 3.0 to 30 g / 10 min, measured at a load of 2.16 kg at 190 ° C., includes c parts by weight, 50≤ c / (b + c) × 100≤70 and 10≤ (b + c) / (a + b + c) × 100≤40 are satisfied.
机译:本发明提供低温耐冲击性和表面特性优异的聚酰胺树脂组合物,以及使用该聚酰胺树脂组合物进行旋转成型的聚酰胺树脂组合物和旋转成型品。在本发明的聚酰胺树脂组合物中,根据JIS K6920,在25℃的条件下测得96重量份的硫酸,1重量%的聚合物浓度和相对粘度ηr小于2.60的脂肪族聚酰胺。 ℃,重量份,ASTM D1505,按b重量份计,密度为0.895g / cm 3以下的改性聚烯烃,和MFR值为3.0〜30g / 10min,未改性的聚烯烃在190°C下以2.16 kg的载荷运行时,包括c重量份,50≤c /(b + c)×100≤70和10≤(b + c)/(a + b + c)×100≤ 40个满意。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号