Manufacturing method and mold of photosensitive assembly, imaging module, Intel terminal and photosensitive assembly.Rectangular hard plate area,The invention includes a soft board extended from the hard board field.ad locum,There are news and non news media in the field of hard board.News media owns the field of news;Sensitive elements in the hard board area of the circuit board;And formed in the field of hard plate,Around the photosensitive element, it extends to the photosensitive element and contacts the photosensitive element,The mold is the inside surface,Outside surface and top layer,Do not cover the printing area of the hard board field,The top surface includes a molding part with a flat part,ad locum,The die plate part has a settlement part on the top surface of the press,The settlement part is located between the flat part and the outer surface of the settlement part,Lower than a flat place,Maoding part is a sensitive Royal Blue characterized by that the outer surface of the non press part is perpendicular to the flat part.
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