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In-situ microwave-assisted leaching process with selective separation of gold and copper from waste PCBs
In-situ microwave-assisted leaching process with selective separation of gold and copper from waste PCBs
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机译:原位微波辅助浸出工艺,可从废PCB中选择性分离金和铜
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摘要
The present invention relates to a leaching method in which the leaching of precious metals and non-precious metals from a waste printed circuit board and selective separation by a hydrophobic ionic liquid are continuously performed. The present invention can improve the leaching speed and efficiency of noble and non-precious metals by pulverizing the waste printed circuit board by adding microwaves to the leach solution compared to the conventional leaching process.
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