An experimental numerical analysis method for a room temperature Cu metal coating through a powder spray process is disclosed. The effect of Cu particles on the deposition behavior of the Cu coating layer is investigated by experimental and numerical studies to reveal the coating behavior of metal films during the aerosol deposition (AD) process. Experimental results show that the Cu film processed using 2㎛ Cu powder has a dense microstructure with high deposition rate (1.52 ±0.6㎛/min) and low electrical resistivity (9.5 ±0.4μΩcm), and high internal microdeformation ( micro-strain). Moreover, Cu films processed using 2 μm Cu powder had a dense microstructure and a Cu oxide phase due to the elevated temperature caused by the kinetic energy of the impacted particles. However, Cu films prepared using 5 μm Cu powder formed a thin deposition layer of 0.5 μm or less having a poor structure and electrical properties. Numerical results show that the strain and heat generated at the collision interface between the particle and the substrate decrease significantly as the particle size increases. In contrast, the maximum impact pressure of the metallic Cu particles increased with increasing the Cu particle size. These results are suitable for metal Cu particles having a size of about 2 μm to form a high-quality coating layer, and their bonding is related to high compressive strain and thermal energy.
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