Cleaning systems for wire bonding tools, wire bonding machines comprising such systems, and related methods

摘要

A wire bonding machine is provided. The wire bonding machine comprises: (a) a wire bonding tool, (b) a wire guide for guiding the wire to a position below the bonding surface of the wire bonding tool-the wire guide is, (i) bonding to the wire bonding tool Configured for movement between a position and (ii) a non-engaged position relative to the wire bonding tool-, and (c) cleaning at least a portion of the tip of the wire bonding tool when the wire guide is in a non-engaged position. Includes a cleaning station for.