Space saving, high density modular data pod systems and energy efficient cooling systems are disclosed. The modular data pod system includes a central air conditioning system and a number of modular data pods. The modular data pod includes a heat exchange assembly coupled to a central air conditioning system and a distributed mechanical cooling system coupled to the heat exchange assembly. Modular data pods are a polygonal data enclosure with at least five walls, multiple computer racks in a circular or U-shape, a cover to create cold and hot aisles, and a continuous air flow between hot and cold aisles. An air circulator configured to circulate. The modular data pod also includes an auxiliary enclosure that includes shared fluid and electrical circuit sections coupled to adjacent shared fluid and electrical circuit sections and connected to a central ambient air cooling system. The secondary enclosure includes at least a portion of a distributed mechanical cooling system, configured to tailor the cooling performed by the central outdoor air conditioning system.
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