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One chip image sensor manufacturing method for simultaneously sensing visible ray and near infrared ray

机译:同时感测可见光和近红外线的一种芯片图像传感器的制造方法

摘要

The present invention relates to a single-chip image sensor capable of simultaneously detecting visible light and near-infrared light, which simultaneously detects visible light and near-infrared light in one image sensor, so that the surrounding object can be recognized with high sensitivity even during the day and at night. will be. A single chip image sensor capable of simultaneously detecting visible light and near infrared light according to the present invention includes a visible light receiver 112 and a NIR light receiver 113 on a silicon (Si) substrate 100 in a CMOS image sensor (CIS). A light receiving unit 110 and a logic and signal processing unit are formed, and an IR cut filter 130 and a visible-ray cut filter 135 are disposed side by side on the silicon substrate 100. The color filter 140 is disposed on the infrared cut filter 130 and the visible light cut filter 135, and the planarization layer 150 is formed on the color filter 140. Since the microlens array 170 is disposed on the upper portion of the 150, the image sensor and the near-infrared image sensor may be integrated on a single chip, thereby reducing manufacturing costs and configuring a compact device.
机译:单芯片图像传感器技术领域本发明涉及一种能够同时检测可见光和近红外光的单芯片图像传感器,其在一个图像传感器中同时检测可见光和近红外光,从而即使在高灵敏度下也能够识别周围物体。在白天和晚上。将会。根据本发明的能够同时检测可见光和近红外光的单芯片图像传感器包括在CMOS图像传感器(CIS)中的硅(Si)衬底100上的可见光接收器112和NIR光接收器113。形成光接收单元110以及逻辑和信号处理单元,并且IR截止滤光器130和可见光截止滤光器135并排布置在硅基板100上。滤色器140布置在红外截止处。滤光器130和可见光截止滤光器135,并且平坦化层150形成在滤色器140上。由于微透镜阵列170设置在滤光器150的上部,因此图像传感器和近红外图像传感器可以是集成在单个芯片上,从而降低了制造成本并配置了紧凑的设备。

著录项

  • 公开/公告号KR102086893B1

    专利类型

  • 公开/公告日2020-03-09

    原文格式PDF

  • 申请/专利权人 광주대학교산학협력단;

    申请/专利号KR20170182458

  • 发明设计人 이명복;

    申请日2017-12-28

  • 分类号H01L27/146;

  • 国家 KR

  • 入库时间 2022-08-21 11:05:11

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