Dynamic heat dissipation method for inclusion body and heat source inside enclosure and dynamic heat dissipation system inside enclosure

摘要

A dynamic heat dissipation method for an inclusion body and a heat source inside the enclosure and a dynamic heat dissipation system inside the enclosure are provided. The dynamic heat dissipation method comprises the steps of acquiring a relatively low temperature region of the enclosure; And driving the heat source to move to a relatively low temperature region. In this solution, in a conventional concept, the heat source in a relatively fixed position located inside the enclosure is artificially and actively transformed into a movable heat source, allowing the heat source to self-adapt to the temperature field; A relatively low-temperature region inside the enclosure is searched, using the characteristics of the temperature difference present in the field (temperature field) of the structure (encapsulation body), the position of the heat source is adjusted, and the heat dissipation layout inside the enclosure is adjusted, thereby from the inside of the enclosure. A heat source having an optimal direction of heat transfer to the outside (direction of a temperature gradient) and heat is dissipated at a maximum rate, that is, an enclosure environment for dynamically dissipating heat is provided. Therefore, the operating temperature of the movable heat source is reduced, the service life of the movable heat source is extended, and the reliability and safety of the system are improved.