Au Recovery Method of Gold Waste Solution and Etching Solution used in Semiconductor Processes

摘要

The present invention relates to a method for recovering a waste solution containing gold (Au) generated in a gold plating process or an etching process included in a semiconductor process, and to be described in more detail, it is necessary to simplify the recovery process of the existing gold plating waste solution. It is a technology that purifies wastewater by adsorbing heavy metals in waste liquid except for gold by using pulp of hoesaengjapan. It is excellent in yield while significantly reducing the amount of time and chemicals used.It is environmentally friendly and includes the above recovery process in the existing process line. It is possible, and it relates to a gold (Au) waste solution and an etchant recovery process used in a semiconductor process capable of securing transparency without fear of loss of valuable metals, receiving a waste solution containing gold (Au), and gold from the transferred waste solution (Au) recovering, and comprising the step of adsorbing heavy metals other than gold from the recovered waste liquid, wherein the waste liquid containing gold (Au) is characterized in that the non-cyanide waste liquid, the One heavy metal is characterized by copper (Cu), chromium (Cr), nickel (Ni), manganese (Mn), and zinc (Zn).