An apparatus for processing a substrate in a process chamber is provided herein. In some embodiments, a gas injector for use in a process chamber comprises: a first set of discharge ports providing an inclined injection of a first process gas at an angle to a flat surface; And a second set of discharge ports proximate the first set of discharge ports and providing pressurized laminar flow of the second process gas substantially along the flat surface, the flat surface perpendicular to the second set of discharge ports Is extended.
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