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Process for microstructuring a substrate

机译:用于微结构化基材的方法

摘要

Method for microstructuring a substrate comprising a front and rear side and consisting of a first material, the surface of which can be assigned to the rear side directly adjoins a layer made of a second material, the first and second material having different optical transmission properties with respect to a laser wavelength of a laser beam emitted by a laser system in such a way that when the laser beam passes through the substrate from the front to the back, no material-degrading absorption effects occur within the substrate and the laser beam is at least partially absorbed within the second material, so that the second material interacts with the laser beam occurs and as a result the substrate is structured directly adjacent to the area of the second material interacting with the laser beam by local material removal, characterized in that eites material a liquid in the form of water is used, which wets the back of the substrate at least in regions, and that the laser system is operated to generate a pulsed laser beam with a wavelength between 1.5 microns and 3 microns and with individual pulse durations in the range between 100 fs and 200 ps and with single pulse energies in the range between 100 nJ and 200 µJ.
机译:用于微结构化包括正面和背面并且由第一材料组成的衬底的方法,该第一材料的表面可以分配给背面,该方法直接邻接由第二材料制成的层,该第一和第二材料具有不同的光学透射特性,相对于由激光系统发射的激光束的激光波长,使得当激光束从前向后穿过基板时,在基板内不会发生材料降解的吸收效应,并且激光束处于至少部分地吸收在第二材料内,从而发生第二材料与激光束的相互作用,结果,通过局部材料去除,使衬底直接邻近于第二材料与激光束相互作用的区域而构造,其特征在于:材料使用水形式的液体,它至少局部润湿衬底的背面,并且激光系统是可操作的额定波长为1.5到3微米的脉冲激光束,单个脉冲持续时间在100 fs和200 ps之间,单个脉冲能量在100 nJ和200 µJ之间。

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