The invention relates to a silver electrolyte for depositing silver layers on substrates, which contains potassium silver cyanide, potassium cyanide with a content of at least 10 g / L, at least one grain refiner with a content of 0.2 to 10 g / L, at least one dispersant with a content of 1 to 10 g / L and at least one solid component with a content of 1 to 150 g / L, the particles of the solid component having an average particle size (d 50 ) of 10 nm-100 μm. In addition, contact surfaces and methods for the deposition of such contact surfaces are shown.
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机译：本发明涉及一种用于在基板上沉积银层的银电解质，其包含氰化钾银，氰化钾含量至少为10g / L，至少一种晶粒细化剂含量为0.2-10g / L。至少一种分散剂的含量为1至10 g / L，至少一种固体组分的含量为1至150 g / L，该固体组分的颗粒具有平均粒径（d 50 ）为10 nm-100μm。另外，示出了接触表面和用于沉积这种接触表面的方法。
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