Flow distributor for cooling an electrical assembly, a semiconductor module with such a flow distributor and a method for its production

摘要

A flow distributor 1 is provided for distributing a heat-transporting fluid flow 2 of an electrical component over a surface to be cooled and / or heated by means of the fluid. The distributor has at least one flow channel, which is designed such that the fluid flow is directed over the surface, the flow channels being delimited on both sides by means of walls 4, so as to form a path 6 for the fluid flow 2 within the flow channel 3, and has wall sections 5 which extend into the at least one flow channel 3; and at least one of the wall sections 5 has at least one bypass passage 7 for connecting two adjacent spaces which are separated by the wall section 5, the at least one bypass passage 7 extending from one side of the wall section to the other with an inclined orientation extends so as to create a short circuit flow 9 for part of the fluid flow 2. Furthermore, a method for producing such a flow distributor is provided, which has an insert with the wall structure of the flow distributor according to the invention, which is produced by injection molding or 3D printing.