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DEVICE AND METHOD FOR A DOUBLE-SIDED POLISHING PIECE

机译:双面抛光件的装置和方法

摘要

There is provided a double-side polishing apparatus and a double-side polishing method which enable double-side polishing to be completed at a point in time that enables a polished workpiece to be given a target shape. An arithmetic unit 13 performs a step of grouping the data of thicknesses measured using workpiece thickness measuring devices 11 on a workpiece basis; a step of extracting shape components of each workpiece from the thickness data; a step of identifying a position of each of the mold components in the workpiece radial direction; a step of calculating a shape distribution of the workpiece from the identified position; a step of obtaining a shape index of the workpiece from the calculated shape distribution; and a step of determining the timing of completion of the double-side polishing based on the obtained shape index, thereby determining the timing of completion of the double-side polishing.
机译:提供了一种双面抛光设备和一种双面抛光方法,该双面抛光设备和一种双面抛光方法使得能够在使得被抛光的工件具有目标形状的时间点完成双面抛光。运算单元13执行以下步骤:以工件为基础对使用工件厚度测量装置11测量的厚度数据进行分组;从厚度数据中提取每个工件的形状成分的步骤;确定各模具部件在工件径向上的位置的步骤;从所确定的位置计算出工件的形状分布的步骤;从计算出的形状分布中获得工件的形状指数的步骤;根据获得的形状指数确定双面抛光的时间,从而确定双面抛光的时间。

著录项

  • 公开/公告号DE112018006664T5

    专利类型

  • 公开/公告日2020-10-01

    原文格式PDF

  • 申请/专利权人 SUMCO CORPORATION;

    申请/专利号DE20181106664T

  • 发明设计人 MAMI KUBOTA;KEIICHI TAKANASHI;

    申请日2018-10-22

  • 分类号B24B37/005;B24B37/013;B24B37/08;B24B49/04;H01L21/304;B24B49/12;

  • 国家 DE

  • 入库时间 2022-08-21 11:01:35

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