A grinding apparatus comprising a chuck table for holding a wafer, a grinding unit having a spindle for rotating a grinding wheel, an inclination adjusting unit for adjusting the inclination of the axis of rotation of the chuck table with respect to the axis of rotation of the spindle, a touch panel and a control section. The control section is configured to compare the information related to the target cross-sectional shape entered in an input field of a target shape with the information related to the current cross-sectional shape input in an input field of a current shape, and then to control the inclination setting unit to adjust the inclination of the Change the axis of rotation of the chuck so that the wafer is ground to obtain the target cross-sectional shape of the wafer.
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