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Opto-electronic assembly

机译:光电组装

摘要

An assembly of electronic components such as a Receive Optical Sub-assembly (ROSA) provides means for the reception of data using an optical fibre. The assembly comprises a photodiode 107, an amplifier 108 coupled to said photodiode and a printed circuit board 201. The photodiode and amplifier are physically mounted on the printed circuit board. The printed circuit board has areas of a first material 602 to which components may be attached using a fixing agent and areas of a second material to which components will not attach using the fixing aqent which are configured to fix a location of the cover by use of the fixing agent to align the lens to focus onto the photodiode. A cover 501 covers the photodiode and the amplifier, and is physically attached to the printed circuit board so as to provide mechanical rigidity around the photodiode. It has an optically transparent aperture containing a lens 305 configured to focus modulated light signals from a fibre onto the photodiode. Conductive bond wires 502 are configured to directly electrically couple the amplifier and photodiode to conducting traces on an opposite side of the printed circuit board.
机译:电子组件的组件,例如接收光学子组件(ROSA),提供了使用光纤接收数据的方法。该组件包括光电二极管107,耦合到所述光电二极管的放大器108和印刷电路板201。光电二极管和放大器物理地安装在印刷电路板上。印刷电路板具有可使用固定剂将组件附接到其上的第一材料的区域和使用固定剂将组件不附接到其上的第二材料的区域,这些区域被构造成通过使用固定件固定盖的位置。固定剂以使透镜对准以聚焦到光电二极管上。盖501覆盖光电二极管和放大器,并物理附接到印刷电路板上,以提供围绕光电二极管的机械刚性。它具有一个光学透明的孔径,该孔径包含一个透镜305,该透镜被配置为将来自光纤的调制光信号聚焦到光电二极管上。导电接合线502被配置为将放大器和光电二极管直接电耦合至印刷电路板的相对侧上的导电迹线。

著录项

  • 公开/公告号GB2575204B

    专利类型

  • 公开/公告日2020-08-19

    原文格式PDF

  • 申请/专利权人 HILIGHT SEMICONDUCTOR LIMITED;

    申请/专利号GB20190014522

  • 发明设计人 CARL CARLEY;WILLIAM REDMAN-WHITE;

    申请日2019-10-08

  • 分类号G02B6/24;G02B6/42;H04B10/60;

  • 国家 GB

  • 入库时间 2022-08-21 10:59:56

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