Failure analysis device, failure analysis method, failure analysis program, teacher data creation device, teacher data creation method, and teacher data creation program

摘要

PROBLEM TO BE SOLVED: To provide a failure analysis device capable of accurately analyzing a cause of manufacturing failure. A defect analysis apparatus for analyzing a cause of manufacturing defects in a semiconductor wafer having a plurality of integrated circuits including a plurality of defective integrated circuits, the wafer map indicating positions of the plurality of defective integrated circuits on the semiconductor wafer. The Delaunay triangulation is performed on the point cloud data of a plurality of defective integrated circuits in the data, and the Delaunay diagram having each point data of the point cloud data as vertices is created. A vertex whose length is equal to or greater than a predetermined length is extracted, point data indicating the position of the defective integrated circuit corresponding to the extracted vertex is excluded from the wafer map data, and a correction unit that corrects the wafer map data, And an analysis unit that analyzes the cause of manufacturing defects of the semiconductor wafer using the corrected wafer map data. [Selection diagram] Figure 2