FRP precursor, FRP, laminate, metal-clad laminate, printed wiring board and semiconductor package, and method for producing FRP precursor

摘要

PROBLEM TO BE SOLVED: To provide an FRP precursor capable of providing an FRP having a low coefficient of thermal expansion by specifying an aggregate, to provide an FRP having a low coefficient of thermal expansion, and to bend the aggregate of the FRP precursor, To provide a method for manufacturing while suppressing defects such as breaks, wrinkles, and tears, and a laminate, a metal-clad laminate, a printed wiring board, and a semiconductor package using the FRP precursor or FRP. SOLUTION: An FRP precursor containing quartz glass cloth and a thermosetting resin composition, or an FRP precursor obtained by impregnating a quartz glass cloth with a thermosetting resin film under heat and pressure. [Selection diagram] None