Semiconductor wafer end face evaluation method, semiconductor wafer container evaluation method, semiconductor wafer packaging mode evaluation method, and semiconductor wafer transportation mode evaluation method

摘要

PROBLEM TO BE SOLVED: To provide a new evaluation method for evaluating an end face of a semiconductor wafer. A semiconductor wafer to be evaluated includes a chamfered surface on a wafer end surface, and at least the wafer end surface of the semiconductor wafer to be evaluated is irradiated with light, and specularly reflected light is selectively applied to the wafer end surface irradiated with the light. Taking a photograph with a camera to detect, creating a plurality of brightness distribution curves in the wafer thickness direction from the image obtained by the shooting, creating an average curve of the created brightness distribution curves, the average A threshold curve is created by subtracting the brightness value determined as the correction brightness value from each brightness value on the curve, and a region showing brightness below the value on the above-mentioned threshold curve or below this value on the image is a foreign substance. A method for evaluating an end surface of a semiconductor wafer, which includes determining an adhesion region. [Selection diagram] None