Adhesive composition, adhesive for cross-linking thereof, adhesive film for masking film, adhesive for heat resistant adhesive film, and heat resistant adhesive film for masking

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition containing no organic tin compound, excellent in quick curability while having sufficient pot life, less in increase of adhesive force after using under a high temperature condition, capable of being peeled with small power and further hardly generating contamination when peeled from an adherend and capable of being used for a heat resistant adhesive film for masking.