Mask-integrated surface protection tape and method for manufacturing semiconductor chip using mask-integrated surface protection tape

摘要

To provide a mask-integrated surface protection tape which eliminates mask formation by a photolithography process in manufacturing a semiconductor chip using a plasma dicing method, which exhibits excellent performance in each process of semiconductor chip manufacturing, and which is also excellent in operability and workability, and a method of manufacturing a semiconductor chip using the tape.SOLUTION: There is provided a mask-integrated surface protection tape including at least a base material film, an adhesive layer provided on the base material layer, and a mask material layer provided on the adhesive layer. The mask material layer is radiation curable. The mask material layer has a rupture elongation after radiation curing of 50-250%, and has a storage modulus after radiation curing of 100,000 Pa or more. There is also provided a method of manufacturing a semiconductor chip using the tape.SELECTED DRAWING: Figure 4