PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT DE TRANSFORMATEUR ET TRANSFORMATEUR ASSOCIÉ

摘要

A manufacturing method of transformer circuit board (100) includes following steps: plate stamping (S1), forming a plurality of metal plates (10) with a stamping mold; primary layering (S2), layering the metal plates (10) that are in alignment with each other between two outer insulation layers (20), with an inner insulation layer (21) disposed between the two metal plates (10); primary pressing (S3), hot pressing the metal plates (10) to fix the metal plates (10) between the two outer insulation layers (20); secondary layering (S4), layering another metal plate (10) on the outer side of the two outer insulation layers (20), respectively, corresponding to the positions of the previously layered metal plates (10); secondary pressing (S5), hot pressing the metal plates (10) on the outer side of the outer insulation layers (20), and printing to form a solder mask layer (30) on the outer insulation layers (20). Finally, cutting to form a transformer circuit board (100) with low leakage inductance and high EMI shield.