COMPOSANT, PROCÉDÉ DE FABRICATION D'UN COMPOSANT, AGENCEMENT DE COMPOSANT ET PROCÉDÉ D'APPLICATION D'UN COMPOSANT

摘要

The invention relates to a component 1 for application to a flexible substrate 21, a method for producing a component of this kind, a component arrangement comprising a flexible substrate with conductor tracks and at least one component and a method for applying a component 1 to a flexible substrate. The component 1 comprises a component carrier 2 with a first surface 3 facing towards the substrate 21 and a second surface 4 opposite said first surface 3 and at least one component 5, 6 mounted on the component carrier 2 to which component current and/or voltage may be applied. The component carrier 2 has in particular at least two thermally conductive channels 9 which lead from the first surface 3 to the second surface 4, each connected in a thermally conductive manner to at least one solder pad 10, which is arranged on the first surface 3 of the component carrier 2. The first surface 3 of the component carrier 2 is at least partially coated with an adhesive 11. The solder pads are preferably heated inductively.