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MATÉRIAU DE CUISSON EN FORME DE FILM ET MATÉRIAU DE CUISSON EN FORME DE FILM ÉQUIPÉ D'UNE FEUILLE DE SUPPORT
MATÉRIAU DE CUISSON EN FORME DE FILM ET MATÉRIAU DE CUISSON EN FORME DE FILM ÉQUIPÉ D'UNE FEUILLE DE SUPPORT
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摘要
The present invention provides a film-shaped firing material 1 including sinterable metal particles 10, and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60°C is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60°C is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing material 1 which contains sinterable metal particles and a binder component, and a support sheet 2 which is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.5 N/25 mm.
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