VERFAHREN UND VORRICHTUNG ZUM TESTEN VON HALBLEITERWAFERN MITTELS EINER TEMPERIERBAREN AUFSPANNEINRICHTUNG

摘要

The method involves laying a back side of a semiconductor wafer (5) on a supporting side of a temperable chuck device (1). The wafer is tested, by imprinting a test output of a testing device (TV), by using probes attached to a probe card. Heating energy is reduced with the constant cooling efficiency, under consideration of the detected increase of temperature of fluids flowing via the device during testing of wafers. The chuck device (1) is tempered by an electrical heating equipment (HE) with a predetermined heating energy, and cooling equipments (11a-11c). The testing device is provided in a chip area of a front side of the wafer. An independent claim is also included for an apparatus for testing of semiconductor wafers by using a tempered chuck device.