PROCÉDÉS AU NIVEAU DE LA TRANCHE POUR LA FABRICATION DE COUCHES UNIFORMES DE MATÉRIAU SUR DES MODULES OPTOÉLECTRONIQUES

摘要

Wafer-level methods for manufacturing one or more uniform layers of material on one or more surfaces of a plurality of optoelectronic modules include assembling a wafer assembly, injecting a formable material into the wafer assembly, ejecting excess formable material form the wafer assembly, and hardening one or more formable material layers on one or more surfaces of the plurality of optoelectronic modules such that the hardened one or more formable material layers are the one or more uniform layers of material.