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Parallel sparse matrix solution for direct circuit simulation on a multiple FPGA system

机译:用于多FpGa系统直接电路仿真的并行稀疏矩阵解法

摘要

SPICE, from the University of California, at Berkeley, is the de facto world standard for circuit simulation. SPICE is used to model the behaviour of electronic circuits prior to manufacturing to decrease defects and hence reduce costs. However, accurate SPICE simulations of today's sub micron circuits can often take days or weeks on conventional processors. In a nutshell, a SPICE simulation is an iterative process that consists of two phases per iteration, namely, model evaluation followed by a matrix solution. The model evaluation phase has been found to be easily parallelisable unlike the subsequent phase, which involves the solution of highly sparse and asymmetric matrices. In this thesis, we present an FPGA implementation of a sparse matrix solver hardware,geared towards matrices that arise in SPICE circuit simulations. As such, we demonstrate how we extract parallelism at different granularities to accelerate the solution process. Our approach combines static pivoting with symbolic analysis to compute an accurate task ow-graph which efficiently exploits parallelism at multiple granularities and sustains high floating-point data rates. We also present a quantitative comparison between the performance of our hardware prototype and state-of-the-art software package running on a general purpose PC equipped with a 2.67 GHz six-core 12 thread Intel Core Xeon X5650 microprocessor and 6 GB memory. We report average speedups of 9.65x, 11.83x, 17.21x against UMFPACK, KLU, and Kundert Sparse matrix packages respectively. We also detail our approach to adapt our sparse LU hardware prototype from a single-FPGA architecture to a multi-FPGA system to achieve higher acceleration ratios up to 38x for certain circuit matrices.
机译:来自加州大学伯克利分校的SPICE是事实上的电路仿真世界标准。 SPICE用于在制造之前对电子电路的行为进行建模,以减少缺陷并因此降低成本。但是,在常规处理器上,当今亚微米电路的精确SPICE仿真通常可能需要数天或数周的时间。简而言之,SPICE仿真是一个迭代过程,每个迭代包含两个阶段,即模型评估和矩阵求解。已经发现,模型评估阶段与后续阶段不同,该阶段很容易并行化,后者涉及高度稀疏和不对称矩阵的求解。在本文中,我们提出了一种稀疏矩阵求解器硬件的FPGA实现,主要针对SPICE电路仿真中出现的矩阵。这样,我们演示了如何提取不同粒度的并行度以加快解决过程。我们的方法将静态数据透视与符号分析相结合,以计算出准确的任务流图,该任务流图可有效利用多种粒度的并行性并维持高浮点数据速率。我们还对硬件原型的性能与运行在装有2.67 GHz六核12线程Intel Core Xeon X5650微处理器和6 GB内存的通用PC上的最新软件包之间的性能进行了定量比较。我们针对UMFPACK,KLU和Kundert Sparse矩阵封装分别报告了9.65倍,11.83倍和17.21倍的平均提速。我们还详细介绍了将稀疏LU硬件原型从单FPGA架构改编为多FPGA系统的方法,以针对某些电路矩阵实现高达38倍的更高加速比。

著录项

  • 作者

    Nechma Tarek;

  • 作者单位
  • 年度 2012
  • 总页数
  • 原文格式 PDF
  • 正文语种 {"code":"en","name":"English","id":9}
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