Copper underpotential deposition at gold surfaces in contact with a deep eutectic solvent: New insights

摘要

The electrodeposition of copper on a polycrystalline gold electrode and on Au(hkl) single crystals was investigated in a deep eutectic solvent (DES). The DES employed consisted of a mixture of choline chloride and urea (1:2). The Au(hkl)/DES interface was studied using cyclic voltammetry in the capacitive region. The blank voltammograms showed characteristic features, not previously reported, that demonstrate the surface sensitivity of this solvent. Copper electrodeposition was then studied and it was found that this takes place through the formation of an underpotential deposition (UPD) adlayer, demonstrating the surface sensitivity of this process. Voltammetric profiles showed similarities with those obtained in aqueous solutions containing chloride, suggesting that the copper UPD in this DES is strongly influenced by the presence of chloride.