Interfibre Bonding and Fibre Segment Activation in Paper. A Literature Survey

摘要

In this literature survey, interfiber bonding and fiber segment activation have been studied. Special weight has been given to the factors affecting bonding and activation and to the analysis methods for examining these phenomena. This study has a two-fold purpose: first, it serves as the author's Summer Project for Linkage Program 'Modern Technology in Pulp and Paper Industry, and secondly, it is a literature survey with which the TEKES project MEFINE (Fiber Engineering: Bonding between chemical and mechanical pulp fiber) starts from the part of the Laboratory of Paper Technology, HUT.