Thermoset-thermoplastic aromatic polyamide containing N-propargyl groups

摘要

The compounds of the class of aromatic polyamides useful as matrix resins in the manufacture of composites or laminate fabrication were developed. The process for preparing this thermoplastic-thermoset polyamide system involves incorporating a latent crosslinking moiety along the backbone of the polyamide to improve the temperature range of fabrication thereof wherein the resin softens at a relatively low temperature (approx. 154 C) and subsequently sets-up or undergoes crosslinking when subjected to higher temperature (approx. 280 C).