PRELIMINARY INVESTIGATION OF PARTICLE-SUBSTRATE BONDING OF PLASMA-SPRAYED MATERIALS

摘要

An investigation was undertaken to evaluate the effects of two considerably different plasma spray powders, tungsten and zirconia, and four substrate materials, glass, stainless steel, tungsten, and copper, on the particle-to-substrate bond. All the substrates except glass were metallurgically polished;the glass had a sufficiently smooth surface so that mechanical interlocking would not contribute to the resultant bond.nIt was found that the thermal conductivity of the substrate exerts the greatest control on the quench rate of the plasma-sprayed particles and, therefore, greatly influences the particle-to-substrate bond. In general, as the thermal conductivity of the substrate decreases, the quench rate of the particle decreases and particle adherence increases.