INVESTIGATION OF STICK-SLIP (CHATTER) PHENOMENON OF HTGR THERMAL BARRIER ATTACHMENTnFIXTURE SLIDING INTERFACES PHASE I TEST:CLASS A THERMAL BARRIER HARDWARE AND ENVIRONMENT

摘要

This test program was performed to investigate if significant chatter (stick-slip) would occur at the thermal barrier sliding surfaces. Given such conditions, cyclic loads could be induced in the thermal barrier attachment fixture and studs. A representative section of thermal barrier was tested with realistic HTGR temperature cycles in a high purity helium environment. No significant chatter was detected and there was no visible deterioration of the hardware after testing.