Shock Compression Temperature Rise Determined from Resistivity of Embedded Metal Foils

摘要

The temperature rise induced by shock compression of polymethyl methacrylate (PMMA) was determined from measurements of the electrical resistivity of embedded copper foils. The temperature of the copper was determined from the observed foil resistance and known values of the change in copper resistivity with temperature and shock compression. Temperature values obtained over a stress range from 0.9 to 6.0 GPa are in good agreement with thermocouple measurements reported previously. (ERA citation 81:025940)