Technical Grade Hydrofluoric Acid Etch-Back. Final Report

摘要

Technical grade hydrofluoric acid (TG HF) was compared with analytical reagent grade hydrofluoric acid (AG HF) in the epoxy-glass etch-back process cycle of multilayer printed wiring board (PWB) fabrication. AG HF was in short supply and TG HF was evaluated as a substitute. The two acids were compared for depth of etch-back, completeness of glass fiber removal, and surface topography. Results show that TG HF could be used as an alternate material in this process without any changes in operating parameters.