Study of the Microstructural Processes Which Control High Temperature Crack Growth. Final Progress Report, 1 August 1983-31 July 1984

摘要

During the past year a number of basic experiments on creep crack growth in Cu and Cu + 1 wt % Sb at 500 exp 0 C have been conducted. The presence of Sb in the alloy facilitates brittle intergranular fracture at room temperature and permits a direct SEM study of intergranular cavities at the crack tip. Objective was to determine the conditions for steady state crack growth. Creep tests on Cu + 5 wt % Sn at a variety of stresses and temperatures confirm that this alloy is a class I solid solution. (ERA citation 10:002604)