Stress-relief displacements induced by drilling--applications to holographic measurements of in situ stress. Final technical report, August 15, 1988--August 14, 1990.

摘要

The holographic stressmeter is an instrument which has been developed at Caltech to allow determination of the complete stress tensor from in situ borehole measurements. The stressmeter uses double-exposure holographic interferometry to record the displacements induced by the drilling of a small sidehole into the borehole wall. The local stresses, which are the result of the far-field stresses, concentrated at the borehole, cause deformation of the surface of the borehole wall in the vicinity of the sidehole. The first part of this study uses a thin infinite elastic plate subjected to plane stress at infinity to model the displacements at the borehole wall. However, the existence of some holograms which were difficult to model closely led us to examine the validity of this model. In order to investigate the problem further, we performed a two-dimensional finite element analysis for an elastic box with a terminated hole. We varied the dimensions of the hole to see what effect the radius and depth of the hole might have on the displacements. The plate model predicts that the depth of the hole should have no effect on the horizontal components of displacement, but the finite element results show that the magnitude of both components of the displacement depends on the depth of the sidehole. After considering these results, we developed a new model for the analysis of stress-relief displacements, following the work of Youngdahl and Sternberg (1965). For holes with a depth-to-diameter ratio greater than unity, the simple plane stress elastic plate solution breaks down and does not adequately model the displacements at the surface of the body and near the hole. Since these are the areas most critical to calculate accurately with the holographic technique, the revised model does a better job of fitting the observed data.