DITP: A Flexible Miniaturized Sensory Fusion Processor for Next Generation Interceptor Seekers and Surveillance Sensors

摘要

This paper describes an advanced processor design for the future BMD interceptor seeker and surveillance sensor technology being developed under the sponsorship of the BMDO Technology Office. It offers a unique synergistic solution; efficiently packaging an Embedded High Performance Computer (EHPC) with adaptive, reconfigurable components and mixed analog, digital, microwave and power circuits. While the EHPC provides high performance, programmable, power efficient floating point computations, the adaptive, reconfigurable logic brings flexibility to front end sensor interfaces and tremendous throughput on sensor preprocessing. Advanced packaging allows tremendous internal data bandwidth with 1000 interconnects per layer to accommodate dynamic data/message passing interfaces in real time; also LEGO-like segments that can be accumulated into a highly dense three-dimensional processor system. This gives the flexibility to combine different types of IC components and MCMs from various vendors within a single assembly. This robust-mixed signal processor system is referred to collectively as the Sensor and Fusion Engine (SAFE). The SAFE EHPC will quadruple the power efficiency of current processors by achieving over 200 million floating point operations per second per watt (MFLOPS/Watt). With a packaging thermal capacity of 500 watts, up to 100 CFLOPS segments deliver an order of magnitude improvement in system density. Simply put, the DITP application of SAFE will constitute the densest three-dimensional system assembly ever attempted.