Interface Formation and Solid-Solid Reactions Induced by Cluster Ion Deposition

摘要

Development is reported of a unique phase-space-compressing ion deposition beamline, coupled to an ultrahigh vacuum surface preparation/analysis system. The performance of the beamline in low energy focused deposition is discussed. A system of transferrable, high precision sample holders is described. An embedded-atom code developed for simulation of the cluster impact behavior is described. Initial results are presented for deposition, sticking, and penetration of copper atoms and copper dimers impacting on molybdenum and nickel over a wide range of collision energies.