Thermal-Fluid Analysis and Simulation of High Power Solid-State Laser Diode (SLD) Assemblies.

摘要

The thermal configuration is an important factor determining the successful operation of the high power solid-state laser diode assemblies. The solid-state diode array in an H-package using a conventional water-cooling flow was analyzed using a combined thermal and fluid finite element codes. A successful convergent solution was reached for the typical operation conditions. The results of the temperature and fluid velocity fields were reported and were compared reasonably with the experimental results.