High-Reliability, Low-Cost Integrated Circuits

摘要

The objective of Phase III of this investigation was to demonstrate the reliability of the integrated circuits fabricated in Phase II according to the processes developed in Phase I (see Phase I and Phase II Final Development Reports for High-Reliability, Low-Cost Integrated Circuits, Contract No. N00039-76-C-0240). Devices were evaluated on the basis of a variety of life and environmental tests and the data recorded on magnetic tape for later retrieval and analysis. Computer software programs were developed to allow the data to be presented in a number of ways for evaluation and to allow the calculation of failure rates. (Author)