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Noncontact Characterization of PV Detector Arrays

机译:光伏探测器阵列的非接触表征

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In order to be of value for large area arrays diode testing must not disturb thesensitive electrical contacts typically made up of very soft indium bumps. The objective of the program was to develop and demonstrate a fast, reliable nondestructive technique for non contact; impedance measurement in LWIR HgCdTe PV detector arrays. Five different types of non contact diode evaluation technique were explored. Three of the 5 test techniques examined were based on Capacitance Coupling, Electron Beam and SAW diode probing. The C-coupled and E-beam test approaches included both technique analysis and measurements on diodes. The SAW investigations were only analytical. The possibilities of several types of Optical test approach were also analytically evaluated. A very small effort was devoted to fifth test approach based on UV probing and some preliminary promising results were obtained on several resistors. Section 2 of this report provides an overview of all the techniques surveyed. Section 3 provides a theoretical basis for diode response analysis to optical and electrical stimuli. This section aids in the theoretical understanding of some of the test approaches selected. Section 4 summarizes the results of the test techniques investigated. Section 5 summarizes our conclusions and provides short and long term recommendations for nondestructive FPA testing. The detailed discussions of the test approaches are presented in the Appendices.

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