具有排列整齊的碳納米管陣列的散熱結構及其製造和應用

摘要

一種兩面都具有排列整齊的碳納米管陣列的散熱結構。夾在熱源和冷源之間的碳納米管陣列用作從熱源表面延伸到冷源表面並將熱量從熱源傳遞到冷源的熱界面材料。在一些應用實例中，會用一些粘結材料塗在碳納米管陣列四周，將散熱結構與熱源和冷源連接起來。在另一些應用實例中，碳納米管陣列至少從熱源和冷源的其中一個表面生長出來，並繼續生長直到將兩個表面連接到一起。一部分暴露在環境中而不是夾在熱源和固體冷源之間的碳納米管陣列，實際是作為翅片來增加散熱面積，並改善散熱結構向環境的對流傳熱。A heat dissipation structure with aligned carbon nanotube arrays formed on both sides. The carbon nanotube arrays in between a heat source and a cooler are used as thermal interface material extending and dissipating heat directly from a heat source surface to a cooler surface. In some embodiments, an adhesive material can be used to dispense around carbon nanotube arrays and assemble the heat dissipation structure in between a heat source and a cooler. In some other embodiments, carbon nanotube arrays are formed on at least one of a heat source surface and a cooler surface and connect them together by further growing. The carbon nanotube arrays can be exposed to the environment instead of being in between a heat source and a solid cooler, and can serve as fins to enlarge heat dissipationarea and improve thermal convection. With the development of microelectronic systems, significant challenge of thermal management has to be faced to meet the increasing requirements such as smaller profile, higher performance and longer product lifetime. Conventional thermal interface materials, such as thermal grease, thermal adhesives, and phase change materials, cannot meet the increasing requirement of the heat dissipation from small area.The present invention provides a low cost and simple process thermal management solution to electronic packaging by using high thermal conductivity carbon nanotube arrays. The carbon nanotubes are aligned for greatest thermal conductivity. They grow on the heat spreader surface as thermal interface material dissipating heat directly from a heat source surface to a heat sink surface. This can simplify the fabrication process and reduce the production cost. In some embodiments, a connecting layer may be formed on the coupling surfaces of heat source and heat sink. It helps the carbon nanotube arrays to connect to both surfaces. Good bonding formed by direct growth of carbon nanotube arrays on coupling surfaces is benefit to reduce the thermal contact resistance.The invention can be applied in heating devices or heating components.