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Influence of test methods in critical current degradation of Bi-2223/Ag superconductor tapes by bending strain

机译:测试方法对Bi-2223 / Ag超导体带弯曲应变临界电流降解的影响

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The results of two test methods were compared among three laboratories to determine a standard measurement method of critical current (Ic) as a function of bending strain for Ag-sheathed Bi-2223 superconductors. The VAMAS round-robin-test method (RRT) and the bending-rig method developed by Goldacker were used. The Ic degradation started with less bending strain for RRT than for bending-rig. Average irreversible strains (eirr) were 0.30 percent for RRT and 0.37 percent for bending-rig. Another test identified parameters that affected the results. A modified RRT method, with a current connection between the sample and the electrode, was used to avoid some thermal stresses of the test procedure. The epsilon_(irr) values increased to the level of the bending-rig, but the modified RRT Ic degradation rate with bending strain was higher. The stress states during sample bending differed between these methods. The shear stress was examined as a source of the Ic degradation rate differences with strain in terms of the crack propagation and delamination defects of oxide filaments from the Ag sheath.
机译:在三个实验室中比较了两种测试方法的结果,以确定标准的临界电流(Ic)测量方法,该方法是Ag护套Bi-2223超导体的弯曲应变的函数。使用了由Goldacker开发的VAMAS循环测试法(RRT)和折弯试验法。 Rc的Ic降级始于RRT的弯曲应变小于折弯设备。 RRT的平均不可逆应变(eirr)为0.30%,折弯钻机为0.37%。另一个测试确定了影响结果的参数。在样品和电极之间采用电流连接的改进的RRT方法被用来避免测试过程中的一些热应力。 epsilon_(irr)值增加到折弯机的水平,但修正的RRT Ic随折弯应变的降解率更高。这些方法在样品弯曲过程中的应力状态有所不同。剪切应力被视为是Ic降解速率与应变之间差异的根源,这是从Ag护套的氧化物细丝的裂纹扩展和分层缺陷开始的。

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