首页> 外文期刊>Journal of Applied Polymer Science >Fracture phenomena in micro-and nano-layered polycarbonate/poly(vinylidene fluoride-co-hexafluoropropylene) films under electric field for high energy density capacitors
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Fracture phenomena in micro-and nano-layered polycarbonate/poly(vinylidene fluoride-co-hexafluoropropylene) films under electric field for high energy density capacitors

机译:高能量密度电容器微纳米层聚碳酸酯/聚偏氟乙烯-共六氟丙烯-薄膜在电场下的断裂现象

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摘要

The long-term dielectric lifetime properties of multilayered polycarbonate/poly(vinylidene fluoride-co-hexafluoropropylene) PC/P(VDF-HFP) films were measured as a function of the layer thickness. An optimum layer thickness of 160 nm was determined with the longest dielectric lifetime. The morphology of the damaged sites after dielectric breakdown was examined using scanning electron microscope. Acoustic emission detection system was coupled with the dielectric setup to correlate fracture events and dielectric breakdown to thereby elucidate the mechanisms of the enhancements in dielectric lifetime properties. Two types of acoustic signals were always observed during the breakdown process for multilayered films. The high-amplitude signals were attributed to the formation of breakdown pinholes caused by the primary discharge from top to bottom electrode. The subsequent low-amplitude signals were attributed to internal discharges that could further damage the film. The total number of acoustic hits, in particular, low-amplitude hits, increased with decreasing layer thickness, indicating more internal discharges occurred along the layered interface. It was concluded that the breakdown event initiated at a defect initiated "hotspot" formed because of internal pressure buildup. The film was punctured when the pressure buildup inside the film overcame the mechanical strength of the film. More number of PC layers and layer interfaces were desirable to slow down and divert the damage propagation through the film thickness direction. The crazes in P(VDF-HFP) can, however, easily propagate across PC layers with less than 160 nm layer thickness.
机译:测量了多层聚碳酸酯/聚偏氟乙烯-共六氟丙烯[PC/P(VDF-HFP)]薄膜的长期介电寿命特性,作为层厚度的函数。确定了 160 nm 的最佳层厚度和最长的介电寿命。使用扫描电子显微镜检查介电击穿后受损部位的形态。声发射检测系统与介电装置相结合,将断裂事件和介电击穿联系起来,从而阐明介电寿命特性增强的机制。在多层薄膜的击穿过程中,始终观察到两种类型的声信号。高振幅信号归因于从上到下电极的一次放电引起的击穿针孔的形成。随后的低振幅信号归因于可能进一步损坏薄膜的内部放电。声学撞击的总数,特别是低振幅撞击,随着层厚的减小而增加,表明沿层状界面发生了更多的内部放电。得出的结论是,击穿事件是在由于内部压力积聚而形成的缺陷引发的“热点”处引发的。当薄膜内部的压力积聚超过薄膜的机械强度时,薄膜被刺破。需要更多的PC层和层界面,以减慢和转移损伤在薄膜厚度方向上的传播。然而,P(VDF-HFP)中的热潮可以很容易地在层厚度小于160纳米的PC层上传播。

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