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机译:
School of Chemical Engineering and Technology, Harbin Institute of Technology, Harbin 15000, China;
National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology, Harbin 150001, China;
机译:Investigation of curing kinetics of epoxy resin/novel nanoclay-carbon nanotube hybrids by non-isothermal differential scanning calorimetry
机译:Polyaniline as a Curing Agent for Epoxy Resin: Cure Kinetics by Differential Scanning Calorimetry
机译:Investigation of isothermal and dynamic cure kinetics of epoxy resin/nadic methyl anhydride/dicyandiamide by differential scanning calorimetry (DSC)
机译:用于3DIC TSV包装的Cure Kinetics和Gang键合过程的固化动力学和流动力学的非导电膜分析
机译:analysis of Curing Reaction for Epoxy Resin Used for Electrical Insulators: part I Kinetic analysis of Curing Reaction
机译:体外致突变性测试。 I.Kermide 601Resin,sylgard 184Encapsulating Resin和sylgard 184Curing agent。