Thermal Pressure Coefficient of a Polyhedral Oligomeric Silsesquioxane (POSS)-Reinforced Epoxy Resin

摘要

The thermal pressure coefficients of a neat, unfilled, epoxy resin and a 10 wt POSS (polyhedral oligomeric silsesquioxane)-filled epoxy nanocomposite have been measured using a thick-walled tube method. It is found that just below the glass transition temperature the thermal pressure coefficient is 20 smaller for the polymer composite containing 10 POSS than for the neat, unfilled resin. The thermal expansion coefficient and thermal pressure coefficient of the uncured POSS itself are also reported.